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Infrared transceiver cover shell mold

SYSTEM SPECIFICATION:

An Infrared transceiver cover mold can be used to produce a variety of parts including infrared transmitters and receivers. These molds are made of a variety of materials, including silicon, glass, and ceramic. An IC 41 is attached to the substrate 40 with wire bonding, while an infrared emitting diode is placed in the middle. Then a shielding housing 46 surrounds the device, and two windows on the front cover are provided. The shielding housing is attached to the top of the IC, and a binder compound is used to encapsulate the entire device. The mold is then filled with a binder, which then tightens the bond between the infrared transceiver and the cover shell.

Mold Name	Infrared transceiver cover mold
Product Material	PC 923A-71258
Mold Steel for cavity	2738H
Mold Steel For Core	2738H
Steel For Base	S50C
Mold Estimated Size	350350320mm
Mold Weight	260kg
Press Machine Size	200T
MOQ	1 Set
Trade Terms	FOB
Payment Terms	50% prepayment before design making, 50% payment after final sample is confirmed.

Suzhou Huihong Electric Co., Ltd.

Suzhou Huihong Electric Co., Ltd. is a professional manufacturer of precision molds, injection molding, assembling and silk-printing. Infrared transceiver cover shell mold Suppliers. Some moulds are exported to Japan, Europe and the United States. We have the right to import and export the goods. As Custom Infrared transceiver cover shell mold Maker, We can develop and manufacture the moulds according to the needs of our customers. We pay attention to quality control, new project development, personnel training, team spirit. In recent years, we have established long-term business relationships with many well-known enterprises at home and abroad.